For parent company of Samsung in Korea; seeking people with considerable expertise in adhesive DAF (Die Attach Film), used in semiconductor packaging.

Title: R&D Manager

Summary of Position:

Research and develop Die Attach Film (DAF) with high reliability and processibility. Technical support for customers through failure analysis.

You will be working in Korea, at Electronic Materials Business Unit Film Materials R&D Center, Adhesive Technology Group(DAF), at the parent company of Samsung.

Duties and Responsibilities:

- Understand semiconductor packaging process, especially stacked chip-scale package (sCSP)

- Have technology regarding recipe and manufacture method of epoxy-based die adhesives (paste or film) for semiconductor
packaging

- Research and develop Die Attach Film (DAF) complete products satisfying customers’need for reliability and processibility of sCSP

- Research and develop future die adhesives (paste or film) satisfying customers’ need for TSV interconnection package.

- Technical support for customers through failure analysis.


Must be interested and willing to relocate to Korea.